%0 Journal Article
%T The monolithic integration system of bulk-Si sensors and actuators based on the Au–Au bonding technology
%A Cai, Chunhua
%A Qin, Ming
%J Microsystem Technologies
%V 19
%N 2
%P 195-201
%@ 0946-7076
%D 2012-06-24
%I Springer-Verlag
%~ DeepDyve