%0 Journal Article
%T ARC and gap fill material with high etch rate for advanced dual damascene process
%A Shinjo, Tetsuya
%A Qin, Anwei
%A Nakajima, Yasuyuki
%J Proceedings of SPIE
%V 5753
%N 1
%P 636-643
%@ 0277-786X
%D 2005-05-04
%I SPIE
%~ DeepDyve