%0 Journal Article
%T Technology for Manufacturing TSV Structures for the Creation of Silicon Interposers Using Temporary-Bonding Technology
%A Djuzhev, N. A.
%A Gusev, E. E.
%A Fomichev, M. Yu.
%A Ivanin, P. S.
%J Nanobiotechnology Reports
%V 19
%N 2
%P 197-207
%@ 2635-1676
%D 2024-04-01
%I Pleiades Publishing
%~ DeepDyve