%0 Journal Article
%T Development of Molding Compounds Based on Epoxy Resin/Aromatic Amine/Benzoxazine for High‐Temperature Electronic Packaging Applications
%A Gou, Haolan
%A Bao, Ying
%A Huang, Jiateng
%A Fei, Xiaoma
%A Li, Xiaojie
%A Wei, Wei
%J Macromolecular Materials and Engineering
%V 307
%N 12
%@ 1438-7492
%D 2022-12-01
%I Wiley Subscription Services, Inc., A Wiley Company
%~ DeepDyve