%0 Journal Article %T Development of Molding Compounds Based on Epoxy Resin/Aromatic Amine/Benzoxazine for High‐Temperature Electronic Packaging Applications %A Gou, Haolan %A Bao, Ying %A Huang, Jiateng %A Fei, Xiaoma %A Li, Xiaojie %A Wei, Wei %J Macromolecular Materials and Engineering %V 307 %N 12 %@ 1438-7492 %D 2022-12-01 %I Wiley Subscription Services, Inc., A Wiley Company %~ DeepDyve