%0 Journal Article
%T Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints
%A Rudajevová, A.
%A Dušek, K.
%J Journal of Electronic Materials
%V 43
%N 7
%P 2479-2486
%@ 0361-5235
%D 2014-04-07
%I Springer US
%~ DeepDyve