%0 Journal Article
%T A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits
%A Yan, Han
%A Niu, Xinhuan
%A Qu, Minghui
%A Luo, Fu
%A Zhan, Ni
%A Liu, Jianghao
%A Zou, Yida
%J The International Journal of Advanced Manufacturing Technology
%V 125
%N 1-2
%P 47-71
%@ 0268-3768
%D 2023-03-01
%I Springer London
%~ DeepDyve