%0 Journal Article
%T Electromigration Study on Micro-vias of Multi-layer Anodic Alumina Substrate with a Thermal Compensated on-line Measurement Scheme
%A Zhu, Dapeng
%A Guo, Junrong
%A Luo, Le
%A ,
%J 2007 8th International Conference on Electronic Packaging Technology
%D 2007-08-01
%I IEEE
%~ DeepDyve