%0 Journal Article
%T Detection of solder bump defects on a flip chip using vibration analysis
%A Liu, Junchao
%A Shi, Tielin
%A Xia, Qi
%A Liao, Guanglan
%J "Frontiers of Mechanical Engineering"
%V 7
%N 1
%P 29-37
%@ 2095-0233
%D 2012-03-01
%I SP Higher Education Press
%~ DeepDyve