%0 Journal Article
%T Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging
%A Wang, Fengjiang
%A Yang, Dapeng
%A Yin, Guoqing
%J Soldering & Surface Mount Technology
%V 37
%N 2
%P 127-138
%@ 0954-0911
%D 2025-03-19
%I Emerald Group Publishing Limited
%~ DeepDyve