%0 Journal Article
%T Nickel silicon thin film as barrier in under-bump-metallization by magnetronsputtering deposition for Pb-free chip packaging
%A Li, Y.
%A Chen, J.
%A Lazik, C.
%A Wang, P.
%A Yang, L.
%A Yu, J.
%A Sun, T.
%A Ko, E.
%J Journal of Materials Research
%V 20
%N 10
%P 2622-2626
%@ 0884-2914
%D 2005-10-01
%I Springer International Publishing
%~ DeepDyve