%0 Journal Article
%T Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints
%A Shin, C.
%A Baik, Y.
%A Huh, J.
%J Journal of Electronic Materials
%V 30
%N 10
%P 1323-1331
%@ 0361-5235
%D 2001-06-23
%I Springer-Verlag
%~ DeepDyve