%0 Journal Article
%T Smart-pixel-based free-space interconnects: solving the high-speed multichip packaging bottleneck
%A Haney, Michael W.
%J Proceedings of SPIE
%V 4534
%N 1
%P 93-100
%@ 0277-786X
%D 2001-11-08
%I SPIE
%~ DeepDyve