%0 Journal Article
%T The Use of Thermal Imaging to Assess Electronic Components
%A Gionis, N.
%A Campbell, D.S.
%J Microelectronics International
%V 7
%N 2
%P 34-38
%@ 1356-5362
%D 1990-02-01
%I Emerald Group Publishing Limited
%~ DeepDyve