%0 Journal Article
%T The Realization of Silicon‐on‐Insulator Utilizing Trench‐before‐Bond and Polish Stop Technology
%A Baine, P. T.
%A Gay, D. L.
%A Armstrong, B. M.
%A Gamble, H. S.
%J Journal of the Electrochemical Society
%V 145
%N 5
%P 1738-1743
%@ 0013-4651
%D 1998-05-01
%~ DeepDyve