%0 Journal Article
%T An on‐wafer embedded passive device using chip‐in‐substrate packaging technology
%A Liang, Junge G.
%A Kim, Eun Seong
%A Wang, Cong
%A Youn, Je‐Hyun
%A Park, Min Chul
%A Kim, Nam Young
%J Microwave and Optical Technology Letters
%V 57
%N 9
%P 2060-2067
%@ 0895-2477
%D 2015-09-01
%I Wiley Subscription Services, Inc., A Wiley Company
%~ DeepDyve