%0 Journal Article
%T Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density
%A Gong, Yubing
%A Liu, Longgen
%A He, Siliang
%A Yan, Haidong
%A Li, Wangyun
%A Qin, Hongbo
%J Journal of Materials Science:Materials in Electronics
%V 33
%N 32
%P 24906-24919
%@ 0957-4522
%D 2022-11-01
%I Springer US
%~ DeepDyve