%0 Journal Article
%T Ultra-high selectivity TSV etching hardmask process development and integration for 3D-SIC
%A Lau, Guan Kian
%A Praveen, Sampath Kumar
%A Lee, Steven
%A Loh, LengWoon
%A Wei, Deng
%A Paulasaari, Jyri
%A Thomas, David
%A Laukkanen, Markus
%A McLaughlin, William
%A Rantala, Juha T.
%A Li, YuHong
%A Shan, Gao
%A ,
%J 2011 IEEE 13th Electronics Packaging Technology Conference
%D 2011-12-01
%I IEEE
%~ DeepDyve