%0 Journal Article
%T Application of HfN/Hf Bilayered Film as a Diffusion Barrier for Cu Metallization System   of Si Large-Scale Integration
%A Ken-ichi Yoshimoto, Ken-ichi Yoshimoto
%A Satoko Shinkai, Satoko Shinkai
%A Katsutaka Sasaki, Katsutaka Sasaki
%J Japanese Journal of Applied Physics
%V 39
%N 4R
%@ 0021-4922
%D 2000-04-01
%~ DeepDyve