%0 Journal Article
%T Modular parametric finite element modelling for reliability-studies in electronic and mems packaging
%A Wunderle, B.
%A Auersperg, J.
%A Großer, V.
%A Kaulfersch, E.
%A Wittler, O.
%A Michel, B.
%J Microsystem Technologies
%V 10
%N 5
%P 375-381
%@ 0946-7076
%D 2007-05-23
%I Springer-Verlag
%~ DeepDyve