%0 Journal Article
%T Analytical and finite element methodology modeling of the thermal management of 3D IC with through silicon via
%A Wu, Mei-Ling
%A Lan, Jia-Shen
%J Soldering & Surface Mount Technology
%V 28
%N 4
%P 177-187
%@ 0954-0911
%D 2016-09-05
%I Emerald Group Publishing Limited
%~ DeepDyve