%0 Journal Article
%T Soldering deterioration of epoxy‐molded IC packages after moisture absorption
%A Asai, Shin'ichiro
%A Saruta, Uki
%A Tobita, Masanori
%J Journal of Applied Polymer Science
%V 51
%N 11
%P 1945-1958
%@ 0021-8995
%D 1994-03-14
%I Wiley Subscription Services, Inc., A Wiley Company
%~ DeepDyve