%0 Journal Article %T Soldering deterioration of epoxy‐molded IC packages after moisture absorption %A Asai, Shin'ichiro %A Saruta, Uki %A Tobita, Masanori %J Journal of Applied Polymer Science %V 51 %N 11 %P 1945-1958 %@ 0021-8995 %D 1994-03-14 %I Wiley Subscription Services, Inc., A Wiley Company %~ DeepDyve