%0 Journal Article
%T Adhesion of Cu and low-k dielectric thin films with tungsten carbide
%A Lemonds, A. M.
%A Kershen, K.
%A Bennett, J.
%A Pfeifer, K.
%A Sun, Y. M.
%A White, J. M.
%A Ekerdt, J. G.
%J Journal of Materials Research
%V 17
%N 6
%P 1320-1328
%@ 0884-2914
%D 2002-06-01
%I Springer International Publishing
%~ DeepDyve