%0 Journal Article
%T Modeling Copper CMP Removal Rate Dependency on Wafer Pressure, Velocity, and Dissolved Oxygen Concentration
%A DeNardis, Darren
%A Doi, Toshiro
%A Hiskey, Brent
%A Ichikawa, Koichiro
%A Ichikawa, Daizo
%A Philipossian, Ara
%J Journal of the Electrochemical Society
%V 153
%N 5
%P G428-G436
%@ 0013-4651
%D 2006-03-23
%~ DeepDyve