%0 Journal Article
%T Process factors affecting adhesion of encapsulation molding compounds
%A Liaw, Yow-Ching
%A Chao, Shou-Yen
%A Chou, Jung-Hua
%J Microelectronics International
%V 35
%N 2
%P 97-103
%@ 1356-5362
%D 2018-04-03
%I Emerald Group Publishing Limited
%~ DeepDyve