%0 Journal Article
%T High-resolution patterning for panel level packaging
%A Mori, Ken-Ichiro
%A Shelton, Douglas
%A Goto, Yoshio
%A Suda, Hiromi
%A Wada, Hiroyuki
%A Tanaka, Hideo
%A Miura, Seiya
%J Proceedings of SPIE
%V 11613
%P 116130C-116130C-12
%@ 0277-786X
%D 2021-02-22
%I SPIE
%~ DeepDyve