%0 Journal Article
%T A novel capillary-effect-based solder pump structure and its potential application for through-wafer interconnection
%A Gu, Jiebin
%A Pike, W T
%A Karl, W J
%J Journal of Micromechanics and Microengineering
%V 19
%N 7
%P 7
%@ 0960-1317
%D 2009-07-01
%~ DeepDyve