%0 Journal Article
%T (Sn-Ag)eut+Cu soldering materials, part II: Electrical and mechanical studies
%A Jacob, K.
%A Jayadevan, K.
%J Journal of Phase Equilibria and Diffusion
%V 25
%N 2
%P 122-124
%@ 1547-7037
%D 2004-04-17
%I Springer-Verlag
%~ DeepDyve