%0 Journal Article
%T Investigation of amorphous RuMoC alloy films as a seedless diffusion barrier for Cu/p-SiOC:H ultralow-k dielectric integration
%A Jiao, Guohua
%A Liu, Bo
%A Li, Qiran
%J Applied Physics A: Materials Science  Processing
%V 120
%N 2
%P 579-585
%@ 0947-8396
%D 2015-05-10
%I Springer Berlin Heidelberg
%~ DeepDyve