%0 Journal Article %T Investigation of amorphous RuMoC alloy films as a seedless diffusion barrier for Cu/p-SiOC:H ultralow-k dielectric integration %A Jiao, Guohua %A Liu, Bo %A Li, Qiran %J Applied Physics A: Materials Science Processing %V 120 %N 2 %P 579-585 %@ 0947-8396 %D 2015-05-10 %I Springer Berlin Heidelberg %~ DeepDyve