%0 Journal Article
%T Early Corrosion Detection of Cu-Ag Wedge bonding in Semiconductor Package
%A Supramaniam, Saraswathy
%A Bakar, Maria Abu
%A Jalar, Azman
%J Journal of Failure Analysis and Prevention
%V 22
%N 6
%P 2317-2325
%@ 1529-8159
%D 2022-12-01
%I Springer US
%~ DeepDyve