%0 Journal Article
%T Test of Mechanical Failure for Via Holes and Solder Joints of Complex Interconnect Structure
%A Shang, Yuling
%A Sun, Liyuan
%A Li, Chunquan
%A Ma, Jianfeng
%J Journal of Electronic Testing
%V 33
%N 4
%P 491-499
%@ 0923-8174
%D 2017-07-14
%I Springer US
%~ DeepDyve