%0 Journal Article
%T Thermal deformation measurement of the solder joints in electronic packages using electron moiré method
%A Huimin, Xie
%A Kishimoto, Satoshi
%A Shinya, Norio
%A Fulong, Dai
%A Daqing, Zou
%A Sheng, Liu
%J Strain
%V 35
%N 4
%@ 0039-2103
%D 1999-11-01
%I Wiley Subscription Services, Inc., A Wiley Company
%~ DeepDyve