%0 Journal Article
%T A low‐cost solder‐bumped chip scale package ‐NuCSP
%A Lau, H.John
%A Chang, Chris
%A Chen, Tony
%A Cheng, David
%A Lao, Eric
%J Circuit World
%V 24
%N 3
%P 11-25
%@ 0305-6120
%D 1998-09-01
%I MCB UP Ltd
%~ DeepDyve