%0 Journal Article
%T ॖ-Device fabrication and packaging below 300°C utilizing plasma-assisted wafer-to-wafer bonding
%A Kirchberger, Herwig
%J Proceedings of SPIE
%V 6037
%N 1
%P 603705-603705-5
%@ 0277-786X
%D 2005-12-28
%I SPIE
%~ DeepDyve