%0 Journal Article
%T Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework
%A Chien, Chen-Fu 
%A Hu, Chih-Han
%A Lin, Chi-Yung
%J International Journal of Manufacturing Technology and Management
%V 14
%N 1
%P 130-144
%@ 1368-2148
%D 2008-01-01
%I Inderscience Publishers
%~ DeepDyve