%0 Journal Article
%T Design and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE and bulk silicon etching processes
%A Wu, Mingching
%A Fang, Weileun
%J Journal of Micromechanics and Microengineering
%V 15
%N 3
%@ 0960-1317
%D 2005-03-01
%~ DeepDyve