%0 Journal Article
%T Fabrication and electrical characterization of through-Si-via interconnect for 3-D packaging
%A Kim, Jong-Woong
%J Journal of Micro/Nanolithography, MEMS and MOEMS
%V 8
%N 1
%P 013040-013040-8
%@ 1932-5150
%D 2009-01-01
%I SPIE
%~ DeepDyve