%0 Journal Article
%T Hermetic Sealant Material Possibilities for IR Sensor Packaging
%A Chidambaram, Vivek
%A Bu, Lin
%A Chuan, Kai
%J Journal of Electronic Materials
%V 48
%N 10
%P 6470-6479
%@ 0361-5235
%D 2019-07-19
%I Springer US
%~ DeepDyve