%0 Journal Article
%T Residual Stress Mapping of Epoxy Molding Compound in a Ball Grid Array Microelectronic Package Using a Fluorescent Sensor
%A Muraki, Naoki
%A Matoba, Nobuhiro
%A Hirano, Takayuki
%A Yoshikawa, Masanobu
%A Pezzotti, Giuseppe
%J Applied Spectroscopy
%V 58
%N 2
%P 152-159
%@ 0003-7028
%D 2004-02-01
%I SAGE Publications
%~ DeepDyve