%0 Journal Article
%T Effect of Purging Gas on Wetting Behavior of Sn-3.5Ag Lead-Free Solder on Nickel-Coated Aluminum Substrate
%A Prabhu, K.
%A Varun, M.
%A Satyanarayan,
%J Journal of Materials Engineering and Performance
%V 22
%N 3
%P 723-728
%@ 1059-9495
%D 2012-08-11
%I Springer US
%~ DeepDyve