%0 Journal Article
%T Manufacture of high density interconnection substrates by co‐lamination of inner layers and programmed interconnection joining layers
%A Fjelstad, Joseph
%A Karavakis, Konstantine
%A Haba, Belgacem
%J Circuit World
%V 25
%N 3
%P 9-12
%@ 0305-6120
%D 1999-09-01
%I MCB UP Ltd
%~ DeepDyve