%0 Journal Article
%T Fabrication of 0.95Sn−0.05Au solder micro-bumps for flip-chip bonding
%A Ishii, Takao
%A Aoyama, Shinji
%A Tokumitsu, Masami
%J Journal of Electronic Materials
%V 30
%N 6
%P L25-L27
%@ 0361-5235
%D 2007-06-30
%I Springer-Verlag
%~ DeepDyve