%0 Journal Article
%T Evaluation of Cu/SnAg microbump bonding processes for 3D integration using wafer‐level underfill film
%A Yang, Tsung‐Fu
%A Kao, Kuo‐Shu
%A Cheng, Ren‐Chin
%A Chang, Jing‐Yao
%A Zhan, Chau‐Jie
%J Soldering & Surface Mount Technology
%V 24
%N 4
%P 287-293
%@ 0954-0911
%D 2012-09-14
%I Emerald Group Publishing Limited
%~ DeepDyve