%0 Journal Article
%T Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package
%A Gan, C.
%A Hashim, U.
%J Journal of Materials Science: Materials in Electronics
%V 24
%N 8
%P 2803-2811
%@ 0957-4522
%D 2013-03-13
%I Springer US
%~ DeepDyve