%0 Journal Article
%T Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards
%A Kim, Do-Hyoung
%A Joo, Sung-Jun
%A Kwak, Dong-Ok
%A Kim, Hak-Sung
%J Journal of Micromechanics and Microengineering
%V 25
%N 10
%P 12
%@ 0960-1317
%D 2015-10-01
%~ DeepDyve