%0 Journal Article
%T Simulation of Wire Bonding Process Using Explicit Fem with Ale Remeshing Technology
%A Yang, C. C.
%A Su, Y. F.
%A Liang, Steven Y.
%A Chiang, K. N.
%J Journal of Mechanics
%V 36
%N 1
%P 47-54
%D 2020-02-01
%I Oxford University Press
%~ DeepDyve