%0 Journal Article
%T Mechanical and Electrical Reliability Assessment of Stacking of Ultrathin Chips on Si Interposer Using Back-to-Face Architecture
%A Parès, G.
%A Crecy, F.
%A Anciant, R.
%J Journal of Electronic Materials
%V 43
%N 3
%P 685-694
%@ 0361-5235
%D 2013-08-29
%I Springer US
%~ DeepDyve