%0 Journal Article
%T FEATURES OF METALLIZATION OF SEMICONDUCTOR DEVICE PACKAGES MADE OF ALSIC METAL-MATRIX COMPOSITE
%A Zolotarev, A.A.
%A ", CompanyStockJoint
%A Chumakova, L.V.
%A ", EnterpriseProductionandScientific
%A Pulsar",
%A "Pulsar", EnterpriseProductionand"ScientificCompanyStockJoint
%A ,
%J Electronic engineering. Series 2. Semiconductor device
%@ 2073-8250
%D 2019-01-01
%I Joint Stock Company Scientific and Production Enterprise 'Pulsar'
%~ DeepDyve