%0 Journal Article
%T Liquid dispensing encapsulation in semiconductor packaging
%A Yang, Liyu
%A King, K.Carl
%A Bernstein, B.Joseph
%J Microelectronics International
%V 20
%N 3
%P 29-35
%@ 1356-5362
%D 2003-12-01
%I MCB UP Ltd
%~ DeepDyve