%0 Journal Article
%T Mechanical strength of Sn-3.5Ag-based solders and related bondings
%A Chuang, Chiang-Ming
%A Shih, Po-Cheng
%A Lin, Kwang-Lung
%J Journal of Electronic Materials
%V 33
%N 1
%P 1-6
%@ 0361-5235
%D 2004-05-17
%I Springer-Verlag
%~ DeepDyve