%0 Journal Article
%T The use of 3D in‐mold decoration technology to form a film with printed circuits
%A Wu, Cheng‐Hsien
%A Li, Ji‐Huan
%J Polymer Engineering & Science
%V 60
%N 10
%P 2517-2528
%@ 0032-3888
%D 2020-10-01
%I Wiley Subscription Services, Inc., A Wiley Company
%~ DeepDyve